| PART |
Description |
Maker |
| W77IE58 |
Industrial Temp version of W77LE58 (-40 to 85C)
|
Winbond Electronics
|
| S558-5999-BQ-F |
DUAL 1000BASE-T INDUSTRIAL TEMP
|
Bel Fuse Inc.
|
| ICS8545I |
Low Skew, 1-to-4, LVCMOS-to- LVDS Fanout Buffer. Industrial Temp.
From old datasheet system
|
ICS
|
| PUMA2S16000M-35 PUMA2S16000M-020 PUMA77S16000M-025 |
30MHZ, 8 LAP, IND TEMP, GREEN(FPGA)
15NS, 100 PQFP, IND TEMP(EPLD)
25NS, 100 PQFP, IND TEMP(EPLD)
20NS, 68 PLCC, COM TEMP(EPLD)
30MHZ, 3.3V, 8 LAP, IND TEMP(FPGA)
7NS, 100 TQFP, COM TEMP(EPLD)
32 MC CPLD,1.8V ISP CPLD,44 PIN TQFP(EPLD)
x32 SRAM Module X32号的SRAM模块
|
Fujitsu, Ltd.
|
| 5962D9960601QUA 5962D9960601QUC 5962D9960601QUX 59 |
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish gold. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory option. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish hot solder dipped. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish gold. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish factory option. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish hot solder dipped. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish factory option. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish gold. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. Total dose none.
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish factory option. Total dose none.
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose none.
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose 3E4(30krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. Total dose 3E4(30krad(Si)).
512K x 8 SRAM. 100ns access time, 5V operation. Prototype flow. Lead finish factory option.
512K x 8 SRAM. 100ns access time, 5V operation. Extended industrial temp rang flow. Lead finish gold.
|
Aeroflex Circuit Technology
|
| ADT7318ARQZ ADT7317ARQZ ADT7316ARQZ |
DIGITAL TEMP SENSOR-SERIAL, 8BIT(s), 5Cel, RECTANGULAR, SURFACE MOUNT LEAD FREE, MO-137-AB, QSOP-16
DIGITAL TEMP SENSOR-SERIAL, 10BIT(s), 5Cel, RECTANGULAR, SURFACE MOUNT LEAD FREE, MO-137-AB, QSOP-16
±0.5°C Accurate Digital Temperature Sensor and Quad Voltage Output 12-Bit DAC; Package: QSOP; No of Pins: 16; Temperature Range: Industrial DIGITAL TEMP SENSOR-SERIAL, 12BIT(s), 5Cel, RECTANGULAR, SURFACE MOUNT
|
Analog Devices, Inc.
|
| AM29LV800BB-120WBI AM29LV800BB-120WBC AM29LV800BB- |
30MHZ, 3.3V, 44 TQFP, IND TEMP(FPGA)
30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA)
30MHZ, 3.3V, 20 PLCC, IND TEMP(FPGA)
8-TSSOP,AUTO,Pb/HALO FREE,NIPDAU LF 2.5V(SERIAL EE)
10MHZ, 20 SOIC, COM TEMP, 5K MOQ(FPGA)
10MHZ, 20 SOIC, IND TEMP, 5K MOQ(FPGA)
30MHZ, 3.3V, 44 PLCC, COM TEMP(FPGA)
30MHZ, 3.3V, 44 TQFP, COM TEMP(FPGA)
30MHZ, 8 LAP, IND TEMP, GREEN(FPGA) x8/x16闪存EEPROM
x8/x16 Flash EEPROM x8/x16闪存EEPROM
32M CONFIG FLASH, 44 PLCC, GREEN(FPGA) x8/x16闪存EEPROM
512K X 16 FLASH 3V PROM, 120 ns, PDSO44
512K X 16 FLASH 3V PROM, 120 ns, PDSO48
10MHZ, 8 PDIP, COM TEMP, 5K MOQ(FPGA)
|
Analog Devices, Inc.
ADVANCED MICRO DEVICES INC
|
| PUMA2X0214I-9035 PUMA2X0214I-9045 PUMA2X0214I-9055 |
10MS, DIE, 1.8V, 9 MIL THICKNESS(SERIAL EE)
10MS, 8 SOIC, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 TSSOP, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 TSSOP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 SOIC, EXT TEMP, 2.7V(SERIAL EE)
10MS, 8 PDIP, IND TEMP, GREEN, 1.8V(SERIAL EE)
SRAM/EPROM 静态存储器/存储
8 ULTRA THIN,MINI MAP,PB/HALO FREE,IND T(SERIAL EE) 静态存储器/存储
10MS, 8 TSSOP, EXT TEMP, GREEN,2.7V(SERIAL EE) 静态存储器/存储
10MS, 8 SOIC, INT TEMP, GREEN, 1.8V(SERIAL EE) 静态存储器/存储
|
Electronic Theatre Controls, Inc.
HIROSE ELECTRIC Co., Ltd.
Maxim Integrated Products, Inc.
|
| PUMA67F16006A-80E PUMA67F16006A-12E PUMA67F16006AI |
The CAT24FC02 is a 2-kb Serial CMOS EEPROM internally organized as 256 words of 8 bits each
120NS, SOIC, IND TEMP(EEPROM)
70NS, PDIP, IND TEMP(EEPROM)
120NS, TSOP, COM TEMP(EEPROM)
200NS, PLCC, COM TEMP(EEPROM)
DIE(EEPROM)
90NS, PGA, 883C; LEVEL B FULLY COMPLIANT(EEPROM)
120NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM)
120NS, PLCC, IND TEMP(EEPROM) X32号，闪存EEPROM模块
x32 Flash EEPROM Module X32号，闪存EEPROM模块
|
Lattice Semiconductor, Corp.
Amphenol, Corp.
|
| GN0012R200BB1280 G0101R000JS7333 G0011K500FE7380 G |
Res Wirewound 2.2 Ohm 0.1% 1W ±50ppm/C Ceramic Hi Temp Sil AXL Thru-Hole Bulk
10W,1OHM,5%,T/R - Tape and Reel
G, GN Wirewound Resistors, Miniature, Industrial, Precision Power, Silicone Coated, Axial Lead
VISGN003R3300FE7080 GN-3-80 .33 1% E70 E
|
Vishay Dale
|
| HDSP-076 HDSP-0760 HDSP-0761 HDSP-0762 HDSP-0773 H |
Hexadecimal and Numeric Displays for Industrial Applications 十六进制数字显示和工业应
16-Bit Buffer/Line Driver with 3-STATE Outputs; Package: TSSOP; No of Pins: 48; Container: Rail
16-Bit Buffer/Line Driver with 3-STATE Outputs; Package: TSSOP; No of Pins: 48; Container: Tape & Reel
HDSP-0961 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0761 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0762 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0772 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0760 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0770 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0771 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0763 · Numeric DIsplays for Industrial Applications
HDSP-0960 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0962 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0963 · Numeric DIsplays for Industrial Applications
HDSP-0860 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0861 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0862 · Hexadecimal and Numeric DIsplays for Industrial Applications
HDSP-0863 · Numeric DIsplays for Industrial Applications
|
Avago Technologies, Ltd.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
|
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